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Solutions
MEMS Sensor Chip Module Field
By integrating micron-scale mechanical structures (e.g., cantilevers, diaphragms) with electronic circuits, we enable sensing and processing of physical signals – including acceleration, pressure, angular velocity, and acoustic waves in the physical world.
MOREOptical Chip Module FieldLeveraging materials like silicon photonics and thin-film lithium niobate, we achieve generation, modulation, transmission, and detection of optical signals.
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Partnerships
The Necessity of Precise Ultra-Fine Particle Removal in Semiconductor Manufacturing
In semiconductor chip manufacturing, cleaning processes run through the entire wafer processing flow, accounting for over 30% of steps. Technical difficulty increases exponentially with process node shrinkage. In semiconductor wafer manufacturing, photovoltaic wafer processing, and chip packaging/testing, precise removal of nanoparticle contaminants has become the "industry cancer" constraining yield.
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